When there's no standard discrete semiconductor available to meet your design requirements, consider a custom solution from Central. Satisfying engineers' most demanding design requirements for the latest applications and delivering exceptional quality service is a passion for the Central team.
Central's Rapid Design and Development process yields a positive result in the shortest possible time. Customers continually choose Central when space, power consumption, environmental factors or electrical specification are primary constraints. Central will perform a thorough feasibility analysis of your request and return results back quickly.
explore the possibilities:
Multi-Discrete Modules™
save board space with MDM™ devices
Central can combine multiple devices or monolithic die into a single package; integrating different device types into a single package often facilitates assembly cost reductions. MDMs are ideal for space-saving designs or applications where an integrated solution or design security is beneficial.
potential combinations:- transistor & diode
- MOSFET & diode
- transistor arrays
- diode arrays
- transistor & rectifier
- MOSFET & rectifier
- MOSFET arrays
- rectifier arrays
custom packaging
custom package designs for your design requirements
example:
Customer required lower than standard profile small signal MOSFET, Central developed the CEDM7001VL & CEDM8001VL in a 0.32mm SOT-883VL package.
special wafer diffusion
special wafer diffusion options
monolithic die
monolithic die
backside metallization
