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CMPZ5241B
11V,350mW Surface mount Diode-Zener Single: Standard
CMPZ5241B product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPZ28X-CMHZ4619
Chip Process Datasheet:CPZ58X-CMHZ4619
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPZ5241B BK Active 11V,350mW Surface mount Diode-Zener Single: Standard Box@3,500 Please call for Qty
EAR99 8541.10.0050 C8R 
Either
PBFREE
TIN/LEAD
CMPZ5241B TR Active 11V,350mW Surface mount Diode-Zener Single: Standard Reel@3,000 In Stock
EAR99 8541.10.0050 C8R 
Either
PBFREE
TIN/LEAD
CPZ58X-CMPZ5241B-CM Active 11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener WafflePack@400 Please call for Qty
EAR99 8541.10.0040  
CPZ58X-CMPZ5241B-WN Active 11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener Wafer@142,858*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.10.0040  
CPZ28X-CMPZ5241B-CM Limited Availability 11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener WafflePack@400 Replaced by CPZ58X-CMPZ5241B-CM
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  
CPZ28X-CMPZ5241B-WN Limited Availability 11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener Wafer@101,184*</br>*Estimated, die qty will vary based on probing Replaced by CPZ58X-CMPZ5241B-WN
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Step File 3D Object:SOT-23
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CLL5241B
11V,500mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CMDZ5241B
11V,250mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CMHZ5241B
11V,500mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CMKZ5241B
11V,200mW Surface mount Diode-Zener Triple: Isolated
Box, Reel
Discontinued, Stock Only

None

 

CMSZ5241B
11V,275mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CPZ28X-CMPZ5241B
11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener
WaferForm, WafflePack
Limited Availability<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ58X-CMPZ5241B">Replaced by:CPZ58X-CMPZ5241B</a>

CPZ58X-CMPZ5241B
11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener
WaferForm, WafflePack
Active

1N5241B
11V,500mW Through-Hole Diode-Zener Single: Standard
Box, Reel
Active

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