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Bare die and wafer devices

Central Semiconductor Corp. has been in the business of manufacturing through-hole discrete semiconductors since 1974; surface mounted devices were added to Central's product portfolio in 1987. In 1996, Central entered the hybrid market to fill the void left after the departure of several manufacturers from the bare die market. These listings feature Central's standard processes available in bare die. Full wafer or chip tray packing options are available.

Devices include:

• Diodes
• Rectifiers
• Transistors
• Protection Devices
• Thyristors

Enter either a principle device type (2N2222A), base device number (2222A) or a Central process number (CP191V) and a drop down will result.

Bare Die Screen Graphic
Bare Die Search Button

Bare Die Product Guide

Online guide featuring Central's standard services and custom capabilities, part numbering nomenclature, selection guide of product specifications with interactive links to part details, and standard gross die per wafer.

  • Complete Bare Die Guide (9.3 MB)

  • Product Specifications Section (1.8 MB)

  • Information Section Contents:
  • Standard & Custom Devices (2.6 MB)
  • Part Numbering (0.6 MB)
  • Online Product Portfolio (2.1 MB)
  • Quality Policy (0.5 MB)

  • Product Specifications Section Contents:
  • Rectifiers (0.2 MB)
  • Schottky Diodes & Rectifiers (0.2 MB)
  • Switching Diodes (0.2 MB)
  • Zener Diodes (0.3 MB)
  • General Purpose Transistors (0.4 MB)
  • RF Oscillator Transistors (0.2 MB)
  • Darlington Transistors (0.2 MB)
  • Low Vce(Sat) Transistors (0.2 MB)
  • MOSFETs & JFETs (0.2 MB)
  • Protection Devices (0.2 MB)
  • Thyristors (0.2 MB)

  • Gross Die Per Wafer & Wafer Size (0.3 MB)
  • BareDieProductGuide

    Bare Die & Wafer Packing Options Guide

    Bare die and wafer packing options (0.5 MB)

    For additional information or questions about custom services, please contact your local sales representative.