your vision, our mission

Bare Die
At the die level, special wafer diffusion may be the best solution. Central will diffuse wafers to yield the required electrical specifications for the requested device. The option of developing a monolithic die can also be explored. Custom backside metallization and marking may also be possible for certain die processes.

Integration
Central can combine multiple devices or monolithic die into a single package; integrating different device types into a single package often facilitates assembly cost reductions. This solution is ideal for space-saving designs or applications where an integrated design or design security is beneficial.

Packaging
Custom packages can be developed to meet specific requirements. Central excels at solving problems with board space that designers may have. Example: Customer required lower than standard profile small signal MOSFET, Central developed the CEDM7001VL & CEDM8001VL in a 0.32mm SOT-883VL package.

Testing
With the constant need to reduce costs, designers seek out commercial-off-the-shelf (COTS) products screened to military equivalents. Central continually invests in new test equipment to meet the requirements of military level and customer-specific screening. For bare die, Central can screen to MIL-PRF-38534, Class H and K equivalents; MIL-PRF-19500, Class HC and KC equivalents. Packaged devices can be screened to MIL-PRF-19500, JANTX, JANTXV, JANS equivalents. Central can also screen to customer specific source control drawings (SCDs).

Complete Solution
One or more of these capabilities may be combined to develop your complete solution. Click below for additional information on solutions provided:

applications product services custom device development up-screening