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CXDM4060P
6A,40V Surface mount MOSFET P-Channel Enhancement Mode High Current
CXDM4060P product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP805-CXDM4060P
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP771-CXDM4060P-CT Discontinued 6A,40V Bare die,32.000 X 55.000 mils,MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP771-CXDM4060P-WN Discontinued 6A,40V Bare die,32.000 X 55.000 mils,MOSFET Wafer@25,800*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  
CXDM4060P BK Special Order Item 6A,40V Surface mount MOSFET P-Channel Enhancement Mode High Current Box@900 Please call for Qty
EAR99 8541.29.0080 CXDM4060P 
Either
PBFREE
TIN/LEAD
CXDM4060P TR Special Order Item 6A,40V Surface mount MOSFET P-Channel Enhancement Mode High Current Reel@1,000 In Stock
EAR99 8541.29.0080 CXDM4060P 
Either
PBFREE
TIN/LEAD
CP805-CXDM4060P-CM Special Order Item 6A,40V Bare die,63.800 X 38.900 mils,MOSFET WafflePack@234 Please call for Qty
EAR99 8541.21.0040  
CP805-CXDM4060P-CT Special Order Item 6A,40V Bare die,63.800 X 38.900 mils,MOSFET WafflePack@234 In Stock
EAR99 8541.21.0040  
CP805-CXDM4060P-WN Special Order Item 6A,40V Bare die,63.800 X 38.900 mils,MOSFET Wafer@17,312*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Sn Plating
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Spice Model:Spice Model CXDM4060P
Material Composition:SOT-89
Process Change Notice:Copper Wire Bonding - SOT-89
Process Change Notice:CP771->CP805
Package Detail Document:SOT-89
Product Reliability Data:SOT-89 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP771-CXDM4060P
6A,40V Bare die,32.000 X 55.000 mils,MOSFET
WaferForm, WafflePack
Discontinued, Stock Only

CP805-CXDM4060P
6A,40V Bare die,63.800 X 38.900 mils,MOSFET
WaferForm, WafflePack
Special Order Item

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