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manufacturer of innovative discrete semiconductor solutions

CXDM3069N
6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current
CXDM3069N product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CXDM3069N BK Discontinued , Stock Only 6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current Box@900 None
EAR99 8541.29.0080 CXDM3069N 
Either
PBFREE
TIN/LEAD
CXDM3069N TR Discontinued , Stock Only 6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current Reel@1,000 In Stock
EAR99 8541.29.0080 CXDM3069N 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Sn Plating
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Spice Model:Spice Model CXDM3069N
Material Composition:SOT-89
Process Change Notice:Copper Wire Bonding - SOT-89
Package Detail Document:SOT-89
Product EOL Notice:CMUD2836
Product Reliability Data:SOT-89 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
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Packaging
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