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CWDM305P
5.3A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current
CWDM305P product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP776-CWDM305P
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP776-CWDM305P-CM Active 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP776-CWDM305P-CT Active 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP776-CWDM305P-WN Active 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET Wafer@57,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CWDM305P BK Special Order Item 5.3A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current Box@350 Please call for Qty
EAR99 8541.29.0080 C503P 
Either
PBFREE
TIN/LEAD
CWDM305P TR13 Special Order Item 5.3A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current Reel@2,500 Please call for Qty
EAR99 8541.29.0080 C503P 
Either
PBFREE
TIN/LEAD
CP776-CWDM305P-CM20 Special Order Item 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET WafflePack@20 Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Die Attach
Analytical Test Report:Lead frame
Analytical Test Report:Wire
Spice Model:Spice Model CWDM305P
Material Composition:SOIC-8
Process Change Notice:SOIC-8 CASE
Package Detail Document:SOIC-8
Product Reliability Data:SOIC-8 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP776-CWDM305P
5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET
WaferForm, WafflePack
Active

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