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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CWDM3011P
11A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current
CWDM3011P product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP802-CWDM3011P
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP775-CWDM3011P-CM Discontinued 11A,30V Bare die,90.000 X 60.000 mils,MOSFET WafflePack@100 In Stock
 EAR99 8541.21.0040  
CP775-CWDM3011P-CT Discontinued 11A,30V Bare die,90.000 X 60.000 mils,MOSFET WafflePack@100 In Stock
 EAR99 8541.21.0040  
CP775-CWDM3011P-WN Discontinued 11A,30V Bare die,90.000 X 60.000 mils,MOSFET Wafer@8,000*</br>*Estimated, die qty will vary based on probing None
 EAR99 8541.21.0040  
CWDM3011P BK Special Order Item 11A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current Box@350 Please call for Qty
 EAR99 8541.29.0080 C3011P 
Either
PBFREE
TIN/LEAD
CWDM3011P TR13 Special Order Item 11A,30V Surface mount MOSFET P-Channel Enhancement Mode High Current Reel@2,500 In Stock
 EAR99 8541.29.0080 C3011P 
Either
PBFREE
TIN/LEAD
CP802-CWDM3011P-CM Special Order Item 11A,30V Bare die,85.830 X 59.450 mils,MOSFET WafflePack@100 In Stock
 EAR99 8541.21.0040  
CP802-CWDM3011P-CT Special Order Item 11A,30V Bare die,85.830 X 59.450 mils,MOSFET WafflePack@100 Please call for Qty
 EAR99 8541.21.0040  
CP802-CWDM3011P-WN Special Order Item 11A,30V Bare die,85.830 X 59.450 mils,MOSFET Wafer@8,360*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Die Attach
Analytical Test Report:Lead frame
Analytical Test Report:Wire
Spice Model:Spice Model CWDM3011P
Material Composition:SOIC-8
Process Change Notice:CP775 -> CP802
Process Change Notice:SOIC-8 CASE
Package Detail Document:SOIC-8
Product Reliability Data:SOIC-8 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CP775-CWDM3011P 		11A,30V Bare die,90.000 X 60.000 mils,MOSFET
WaferForm, WafflePack
Discontinued, Stock Only

CP802-CWDM3011P 		11A,30V Bare die,85.830 X 59.450 mils,MOSFET
WaferForm, WafflePack
Special Order Item

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