CWDM3011N :: Item Details :: 11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

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CWDM3011N
11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

Documentation Links:

Device Datasheet

Case & Material Composition Datasheet

Chip Process Datasheet:CP406-CWDM3011N

Item Number

Status

Description

Packaging Base

Availability

ECCN Code

HTS Code

Part Marking:

Request Samples

CP375-CWDM3011N-CT

Discontinued

11A,30V Bare die,62.000 X 38.000 mils,MOSFET

WafflePack@340

In Stock

EAR99

8541.21.0040

CP375-CWDM3011N-WN

Discontinued

11A,30V Bare die,62.000 X 38.000 mils,MOSFET

Wafer@18,670*</br>*Estimated, die qty will vary based on probing

None

EAR99

8541.21.0040

CWDM3011N BK

Special Order Item

11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

Box@350

Please call for Qty

EAR99

8541.29.0080

C3011N

CWDM3011N TR13

Special Order Item

11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

Reel@2,500

In Stock

EAR99

8541.29.0080

C3011N

CP406-CWDM3011N-CT

Special Order Item

11A,30V Bare die,63.800 X 38.900 mils,MOSFET

WafflePack@340

Please call for Qty

EAR99

8541.29.0040

CP406-CWDM3011N-WN

Special Order Item

11A,30V Bare die,63.800 X 38.900 mils,MOSFET

Wafer@17,312*</br>*Estimated, die qty will vary based on probing

Please call for Qty

EAR99

8541.29.0040

Please note:

If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).

If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).

A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:

Analytical Test Report:Epoxy Molding Compound

Analytical Test Report:Die Attach

Analytical Test Report:Lead frame

Analytical Test Report:Wire

Spice Model:Spice Model CWDM3011N

Material Composition:SOIC-8

Process Change Notice:CP375->CP406

Process Change Notice:SOIC-8 CASE

Package Detail Document:SOIC-8

Product Reliability Data:SOIC-8 Package Reliability

Alternate Devices with Different Packaging:

Datasheet

Part Number

Description

Packaging

Package
Details &
Composition

Status

Availability

CP375-CWDM3011N

11A,30V Bare die,62.000 X 38.000 mils,MOSFET

WaferForm, WafflePack

Chip_Packaging

Discontinued, Stock Only

In stock

Click to view availability

CP406-CWDM3011N

11A,30V Bare die,63.800 X 38.900 mils,MOSFET

WaferForm, WafflePack

Chip_Packaging

Special Order Item

Please call

Click to view availability

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