You are logged in as ::  Guest      Registered user login
manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMPDM7002AHC
1A,60V Surface mount MOSFET N-Channel Enhancement Mode
CMPDM7002AHC product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP379X-CMPDM7002AHC
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPDM7002AHC BK Active 1A,60V Surface mount MOSFET N-Channel Enhancement Mode Box@3,500 Please call for Qty
 EAR99 8541.21.0080 702H 
Either
PBFREE
TIN/LEAD
CMPDM7002AHC TR Active 1A,60V Surface mount MOSFET N-Channel Enhancement Mode Reel@3,000 In Stock
 EAR99 8541.21.0080 702H 
Either
PBFREE
TIN/LEAD
CP379X-7002AHC-CT Active Bare die,31.700 X 31.700 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 In Stock
 EAR99 8541.21.0040  
CP379X-7002AHC-WN Active Bare die,31.700 X 31.700 mils,N-Chan Enhancement Mode MOSFET Wafer@23,600*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Spice Model:Spice Model CMPDM7002AHC
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CP379X-7002AHC 		Bare die,31.700 X 31.700 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

  In order to better serve you, we have created a new web based request system.
Click here to access our new inquiry page. Login to the website is required.
First time users please use the quick and easy one time website registration.

For further assistance using the new web based request system, click here.