Package
Details and
Material Composition
A
new package details section has been added to provide complete,
easy to locate information on the full range of SMD and Leaded
packages manufactured by CentralTM.
These pages are organized by case type and include: Case Mechanical
Dimensions, Mounting Pad Geometry, Tape and Reel specifications,
Part Marking and Packing & Shipping container specifications.
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Surface Mount Package Details and Material Composition data
(PDF format)
Package Details include; case mechanical dimensions, mounting pad geometry, tape and reel specifications, part marking and packing & shipping container specifications.
Material Composition datasheets include; average device mass, material composition of device, bonding wire, lead frame, plating and encapsulation. |
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Leaded Package Details and Material Composition data
(PDF format)
Package Details include; case mechanical dimensions, tape & reel and Ammo Pak specifications, part marking and packing & shipping container specifications.
Material Composition datasheets include; average device mass, material composition of device, bonding wire, lead frame, plating and encapsulation. |
Top of the page
For additional
information please contact
your local sales representative. *
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145 Adams Avenue
Hauppauge, NY 11788 USA
TEL (631) 435-1110
FAX (631) 435-1824 |
