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Central Semiconductor's
RoHS compliance |
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RoHS:
The European Union has adopted Directive 2002/95/EC - the Restriction of Hazardous Substances (RoHS) in electrical and electronic equipment. This legislation bans the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) in electrical and electronic devices after July 1, 2006 with certain exemptions.
Central’s Policy:
Central Semiconductor is doing its part to help improve the environment by reducing and removing any substances that are considered harmful to the environment. Central has put procedures in place to comply with legislation pertaining to environmental concerns. Central has implemented procedures to comply with RoHS banned substances.
Table 1 lists the allowable limits for banned substances.
Table 1 |
| Substance |
Maximum Limit
(ppm ) |
Cadmium (Cd) |
100 |
Lead (Pb) |
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Mercury (Hg) |
1000 |
Hexavalent Chromium (Cr 6+) |
1000 |
Poly Brominated Biphenyls (PBB) |
1000 |
Poly Brominated Diphenyl Ethers (PBDE) |
1000 |
(1) Applicable to products with Pb-free lead finish only.
(2) Maximum limit does not apply to applications for which exemptions
have been granted by the RoHS directive.
Central’s current products do not contain any of the following banned substances: Mercury, Cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). Nearly all of Central’s products are currently available with lead free exterior finishes, in the form of 99.9% matte tin plating. Presently most of Central’s products are available in both Lead free (99.9% Tin), and Tin/Lead finishes.
Special Notations
- Tin Whisker Mitigation Methods:
Central’s Pb free plating meets the following criteria:
a. External plating composition is 99.9% Matte Tin (Sn) minimum.
b. External plating thickness is 315 micro-inches (8µm) minimum.
c. External plating grain size is 40 micro-inches (1µm) minimum.
d. External plating carbon content is 0.1% maximum.
e. Devices do not have a Nickel (Ni) barrier underlayer.
f. Some case types include a post plating anneal bake.
- Central’s Pb free devices are RoHS compliant.
- Central’s Pb free devices are compatible with both tin/lead and lead free solder processes.
- Central’s Pb free devices can withstand a MAX temperature of 260°C for 10 seconds maximum. Click here for Central’s recommended reflow.
Click here for Central’s recommended reflow.
- Central’s Pb free surface mount devices have a Moisture Sensitivity Level (MSL) of 1. (per JEDEC J-STD-020C)
- Central’s Pb free devices are not a change in form, fit or function.
- Central’s Pb free devices are controlled by an internal lot tracking system.
- In order to receive Pb free devices please add a suffix of “Lead Free” to the part number when ordering. (Example: CMPD2004S TR LEAD FREE)
- Devices ordered as Pb free are certified to contain less than 100ppm Pb content on the terminal plating and will be labeled with Central’s Lead Free/RoHS Compliant Logo.
Sample Label
- Devices with tin/lead plating are still available for certain customer’s requirements. Please contact Central’s sales department for additional detail.
Click here for a PDF version of this statement.
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| For additional information please contact the Central sales department at (631) 435-1110. |
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