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thorough device analysis

reliability testing

To achieve perfection in the products manufactured, Central performs reliability testing consisting of environmental and life tests, simulating the adverse conditions devices might encounter throughout their life.

Temperature Cycling

 

device failure analysis

If a failure does occur, Central has the
capability to thoroughly analyze a device and determine the root cause. The Nicolet Real Time
X-Ray affords the ability to view a device's internal construction without the need for deconstruction. Where device deconstruction is required, a de-capsulation system using sulfuric acid is used to gain a complete view of
the interior of a device.

Device Deconstruction System

 

device qualification

During the development process and before a device is released for production, extensive qualification tests are performed which include, electrical, mechanical, environmental, and life tests. In addition, die and wire bond strengths are determined and compared to strict standards.

Die Shear/Wire Pull System




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Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
TEL (631) 435-1110
FAX (631) 435-1824