Central Semiconductor is committed to manufacturing the finest quality and most innovative surface mount discrete devices. Central's broad range of SMD product families is constantly expanding, reflecting the ever-changing requirements of the electronics industry.

Central's surface mount devices are packaged in the leading miniature, ultra miniature, and low profile surface mount packages designed to suit design engineers' needs.

Central Semiconductor continues to manufacture a wide array of through-hole discrete semiconductors in industry standard metal, plastic, and glass packages.

Diminishing source devices discontinued by other manufacturers remain in Central's program as long as there is customer demand. Central's commitment to supporting Diminishing Source products helps to ensure product viability by extending end product life cycles and eliminating costly redesigns.

Central Semiconductor has been in the business of manufacturing through-hole discrete semiconductors since 1974; surface mounted devices were added to the product portfolio in 1987. In 1996, Central entered the hybrid market to fill the void left by the departure of several other manufacturers.

Central's bare die devices are available in a variety of packing options including waffle pack, full unsawn wafer, sawn wafer on metal frame, and sawn wafer on plastic ring. In addition to standard processes, other devices may also be available in bare die form.